View PZU24DDG_5012859.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

PZUxDB2 series
Dual Zener diodes
Rev. 01 -- 31 March 2008 Product data sheet
1. Product profile
1.1 General description
Dual isolated general-purpose Zener diodes in SOT353 (SC-88A) very small Surface-Mounted Device (SMD) standard plastic and dark-green plastic packages.
1.2 Features
I Non-repetitive peak reverse power dissipation: PZSM = 40 W I Total power dissipation: Ptot 250 mW I Tolerance series: B2: approximately 2 % I Wide working voltage range: nominal 2.7 V to 24 V I Dual isolated diodes configuration I Small standard plastic package suitable for surface-mounted design I Small dark-green, halogen-free plastic package suitable for surface-mounted design I AEC-Q101 qualified
1.3 Applications
I General regulation functions
1.4 Quick reference data
Table 1. Symbol Per diode VF PZSM
[1] [2]
Quick reference data Parameter forward voltage non-repetitive peak reverse power dissipation Conditions IF = 100 mA
[1] [2]
Min -
Typ -
Max 1.1 40
Unit V W
Pulse test: tp 300 s; 0.02. tp = 100 s; square wave; Tj = 25 C prior to surge
NXP Semiconductors
PZUxDB2 series
Dual Zener diodes
2. Pinning information
Table 2. Pin 1 2 3 4 5 Pinning Description anode (diode 1) not connected anode (diode 2) cathode (diode 2) cathode (diode 1)
1 2 3 1 2 3
006aab219
Simplified outline
5 4
Graphic symbol
5 4
3. Ordering information
Table 3. Ordering information Package Name PZU2.7DB2 to PZU24DB2[1] PZU2.7DB2/DG to PZU24DB2/DG[1][2]
[1] [2] The series consists of 25 types with nominal working voltages from 2.7 V to 24 V. /DG: halogen-free plastic package
Type number
Description plastic surface-mounted package; 5 leads
Version SOT353
SC-88A
4. Marking
Table 4. Marking codes Marking code[1] T1* T2* T3* T4* T5* T6* T7* T8* T9* TA* TB* TC* TD* TE* Type number[2] PZU2.7DB2/DG PZU3.0DB2/DG PZU3.3DB2/DG PZU3.6DB2/DG PZU3.9DB2/DG PZU4.3DB2/DG PZU4.7DB2/DG PZU5.1DB2/DG PZU5.6DB2/DG PZU6.2DB2/DG PZU6.8DB2/DG PZU7.5DB2/DG PZU8.2DB2/DG PZU9.1DB2/DG Marking code[1] U1* U2* U3* U4* U5* U6* U7* U8* U9* UA* UB* UC* UD* UE* Type number PZU2.7DB2 PZU3.0DB2 PZU3.3DB2 PZU3.6DB2 PZU3.9DB2 PZU4.3DB2 PZU4.7DB2 PZU5.1DB2 PZU5.6DB2 PZU6.2DB2 PZU6.8DB2 PZU7.5DB2 PZU8.2DB2 PZU9.1DB2
PZUXDB2_SER_1
(c) NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 01 -- 31 March 2008
2 of 12
NXP Semiconductors
PZUxDB2 series
Dual Zener diodes
Marking codes ...continued Marking code[1] TF* TG* TH* TK* TL* TM* TN* TP* TR* TS* TT* Type number[2] PZU10DB2/DG PZU11DB2/DG PZU12DB2/DG PZU13DB2/DG PZU14DB2/DG PZU15DB2/DG PZU16DB2/DG PZU18DB2/DG PZU20DB2/DG PZU22DB2/DG PZU24DB2/DG Marking code[1] UF* UG* UH* UK* UL* UM* UN* UP* UR* US* UT*
Table 4. PZU10DB2 PZU11DB2 PZU12DB2 PZU13DB2 PZU14DB2 PZU15DB2 PZU16DB2 PZU18DB2 PZU20DB2 PZU22DB2 PZU24DB2
[1]
Type number
* = -: made in Hong Kong * = p: made in Hong Kong * = t: made in Malaysia * = W: made in China /DG: halogen-free plastic package
[2]
5. Limiting values
Table 5. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Per diode IF IZSM PZSM Per device Ptot Tj Tamb Tstg
[1] [2] [3]
Parameter forward current non-repetitive peak reverse current non-repetitive peak reverse power dissipation total power dissipation junction temperature ambient temperature storage temperature
Conditions
Min [1]
Max 200 see Table 8 40
Unit mA
-
[1]
W
Tamb 25 C
[2] [3]
-55 -65
250 275 150 +150 +150
mW mW C C C
tp = 100 s; square wave; Tj = 25 C prior to surge Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard footprint. Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm2.
PZUXDB2_SER_1
(c) NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 01 -- 31 March 2008
3 of 12
NXP Semiconductors
PZUxDB2 series
Dual Zener diodes
6. Thermal characteristics
Table 6. Symbol Per device Rth(j-a) Rth(j-sp)
[1] [2] [3]
Thermal characteristics Parameter thermal resistance from junction to ambient thermal resistance from junction to solder point Conditions in free air
[1] [2] [3]
Min -
Typ -
Max 500 455 200
Unit K/W K/W K/W
Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint. Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm2. Soldering points at pin 4 and pin 5.
7. Characteristics
Table 7. Characteristics Tj = 25 C unless otherwise specified. Symbol Per diode VF forward voltage IF = 10 mA IF = 100 mA
[1] Pulse test: tp 300 s; 0.02.
[1]
Parameter
Conditions
Min
Typ
Max
Unit
-
-
0.9 1.1
V V
Table 8. Characteristics per type; PZU2.7DB2 to PZU24DB2 and PZU2.7DB2/DG to PZU24DB2/DG Tj = 25 C unless otherwise specified. PZUxDB2 Working PZUxDB2/DG voltage VZ (V) IZ = 5 mA Min 2.7 3.0 3.3 3.6 3.9 4.3 4.7 5.1 5.6 6.2 6.8 7.5
PZUXDB2_SER_1
Differential resistance Reverse current r ()
dif
Temperature coefficient SZ (mV/K) IZ = 5 mA
IR (A) IZ = 0.5 mA IZ = 5 mA Max 1000 1000 1000 1000 1000 1000 800 250 100 80 60 60 Max 100 95 95 90 90 90 80 60 40 30 20 10 Max 20 10 5 5 3 3 2 2 1 0.5 0.5 0.5 VR (V) 1 1 1 1 1 1 1 1.5 2.5 3 3.5 4
Diode Non-repetitive capacitance peak reverse current C (pF)[1]
d
IZSM (A)[2] Max 2.9 3.2 3.5 3.8 4.1 4.34 4.75 5.2 5.73 6.33 6.93 7.6 Typ -2.0 -2.1 -2.4 -2.4 -2.5 -2.5 -1.4 0.3 1.9 2.7 3.4 4.0 Max 440 425 410 390 370 350 325 300 275 250 215 170 Max 8 8 8 8 8 8 8 5.5 5.5 5.5 5.5 3.5
(c) NXP B.V. 2008. All rights reserved.
2.65 2.95 3.25 3.55 3.87 4.15 4.55 4.98 5.49 6.06 6.65 7.28
Product data sheet
Rev. 01 -- 31 March 2008
4 of 12
NXP Semiconductors
PZUxDB2 series
Dual Zener diodes
Table 8. Characteristics per type; PZU2.7DB2 to PZU24DB2 and PZU2.7DB2/DG to PZU24DB2/DG ...continued Tj = 25 C unless otherwise specified. PZUxDB2 Working PZUxDB2/DG voltage VZ (V) IZ = 5 mA Min 8.2 9.1 10 11 12 13 14 15 16 18 20 22 24
[1] [2]
Differential resistance Reverse current r ()
dif
Temperature coefficient SZ (mV/K) IZ = 5 mA
IR (A) IZ = 0.5 mA IZ = 5 mA Max 60 60 60 60 80 80 80 80 80 80 100 100 120 Max 10 10 10 10 10 10 10 15 20 20 20 25 30 Max 0.5 0.5 0.1 0.1 0.1 0.1 0.1 0.05 0.05 0.05 0.05 0.05 0.05 VR (V) 5 6 7 8 9 10 11 11 12 13 15 17 19
Diode Non-repetitive capacitance peak reverse current C (pF)[1]
d
IZSM (A)[2] Max 8.36 9.23 10.21 11.22 12.24 13.49 14.3 14.98 16.51 18.35 20.39 22.47 24.78 Typ 4.6 5.5 6.4 7.4 8.4 9.4 10.4 11.4 12.4 14.4 16.4 18.4 20.4 Max 150 120 110 108 105 103 101 99 97 93 88 84 80 Max 3.5 3.5 3.5 3 3 2.5 2 2 1.5 1.5 1.5 1.3 1.3
8.02 8.85 9.77 10.76 11.74 12.91 13.7 14.34 15.85 17.56 19.52 21.54 23.72
f = 1 MHz; VR = 0 V
tp = 100 s; square wave; Tj = 25 C prior to surge
PZUXDB2_SER_1
(c) NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 01 -- 31 March 2008
5 of 12
NXP Semiconductors
PZUxDB2 series
Dual Zener diodes
103 PZSM (W) 102
006aab215
300 IF (mA) 200
mbg781
10
100
1 10-4
10-3 tp (s)
10-2
0 0.6
0.8 VF (V)
1
Tj = 25 C (prior to surge)
Tj = 25 C
Fig 1.
Non-repetitive peak reverse power dissipation as a function of pulse duration; maximum values
006aab216
Fig 2.
Forward current as a function of forward voltage; typical values
0 SZ (mV/K) -1
10 12 SZ (mV/K) 5 11 10 9.1 8.2 7.5 6.8
mgl274
4.3
3.9 3.6
6.2 5.6 5.1 4.7
-2
3.3 3.0 2.7
0
-3
-5 0 20 40 IZ (mA) 60
0
4
8
12
16
IZ (mA)
20
Tj = 25 C to 150 C PZU2.7DB2 to PZU4.3DB2 PZU2.7DB2/DG to PZU4.3DB2/DG
Tj = 25 C to 150 C PZU4.7DB2 to PZU12DB2 PZU4.7DB2/DG to PZU12DB2/DG
Fig 3.
Temperature coefficient as a function of working current; typical values
Fig 4.
Temperature coefficient as a function of working current; typical values
PZUXDB2_SER_1
(c) NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 01 -- 31 March 2008
6 of 12
NXP Semiconductors
PZUxDB2 series
Dual Zener diodes
102 IZ (mA) 10 VZ(nom) (V) = 2.7 3.0 3.3 3.6 3.9 4.3 4.7
006aab217
102 IZ (mA) 10 VZ(nom) (V) = 6.8 7.5 8.2 9.1 10 11 12 13 14 15
006aab218
16 18
20 22
24
5.1 5.6
6.2 1
1
10-1
10-1
10-2
10-2
10-3 0 1 2 3 4 5 6 VZ (V) 7
10-3 0 5 10 15 20 VZ (V) 25
Tj = 25 C PZU2.7DB2 to PZU6.2DB2 PZU2.7DB2/DG to PZU6.2DB2/DG
Tj = 25 C PZU6.8DB2 to PZU24DB2 PZU6.8DB2/DG to PZU24DB2/DG
Fig 5.
Working current as a function of working voltage; typical values
Fig 6.
Working current as a function of working voltage; typical values
8. Test information
8.1 Quality information
This product has been qualified in accordance with the Automotive Electronics Council (AEC) standard Q101 - Stress test qualification for discrete semiconductors, and is suitable for use in automotive applications.
PZUXDB2_SER_1
(c) NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 01 -- 31 March 2008
7 of 12
NXP Semiconductors
PZUxDB2 series
Dual Zener diodes
9. Package outline
2.2 1.8 5 4 0.45 0.15 1.1 0.8
2.2 1.35 2.0 1.15
1 0.65 1.3 Dimensions in mm
2
3 0.3 0.2 0.25 0.10 04-11-16
Fig 7.
Package outline SOT353 (SC-88A)
10. Packing information
Table 9. Packing methods The indicated -xxx are the last three digits of the 12NC ordering code.[1] Type number PZU2.7DB2 to PZU24DB2 PZU2.7DB2/DG to PZU24DB2/DG
[1] For further information and the availability of packing methods, see Section 13.
Package SOT353
Description 4 mm pitch, 8 mm tape and reel
Packing quantity 3000 -115 10000 -135
PZUXDB2_SER_1
(c) NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 01 -- 31 March 2008
8 of 12
NXP Semiconductors
PZUxDB2 series
Dual Zener diodes
11. Soldering
2.65 0.60 (1x)
2.35
0.40 0.90 2.10
0.50 (4x)
solder lands
0.50 (4x) 1.20 2.40
sot353_fr
solder paste
solder resist occupied area
Dimensions in mm
Fig 8.
Reflow soldering footprint SOT353 (SC-88A)
2.25 2.65
4.50 2.70 0.70
0.30 1.00 4.00
solder lands solder resist occupied area
1.15 3.75 transport direction during soldering
Dimensions in mm
Fig 9.
Wave soldering footprint SOT353 (SC-88A)
PZUXDB2_SER_1
(c) NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 01 -- 31 March 2008
9 of 12
NXP Semiconductors
PZUxDB2 series
Dual Zener diodes
12. Revision history
Table 10. Revision history Release date 20080331 Data sheet status Product data sheet Change notice Supersedes Document ID PZUXDB2_SER_1
PZUXDB2_SER_1
(c) NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 01 -- 31 March 2008
10 of 12
NXP Semiconductors
PZUxDB2 series
Dual Zener diodes
13. Legal information
13.1 Data sheet status
Document status[1][2] Objective [short] data sheet Preliminary [short] data sheet Product [short] data sheet
[1] [2] [3]
Product status[3] Development Qualification Production
Definition This document contains data from the objective specification for product development. This document contains data from the preliminary specification. This document contains the product specification.
Please consult the most recently issued document before initiating or completing a design. The term `short data sheet' is explained in section "Definitions". The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com.
13.2 Definitions
Draft -- The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet -- A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail.
damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer's own risk. Applications -- Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Limiting values -- Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale -- NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. No offer to sell or license -- Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Quick reference data -- The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding.
13.3 Disclaimers
General -- Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes -- NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use -- NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental
13.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners.
14. Contact information
For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com
PZUXDB2_SER_1
(c) NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 01 -- 31 March 2008
11 of 12
NXP Semiconductors
PZUxDB2 series
Dual Zener diodes
15. Contents
1 1.1 1.2 1.3 1.4 2 3 4 5 6 7 8 8.1 9 10 11 12 13 13.1 13.2 13.3 13.4 14 15 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 General description. . . . . . . . . . . . . . . . . . . . . . 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Quick reference data. . . . . . . . . . . . . . . . . . . . . 1 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3 Thermal characteristics. . . . . . . . . . . . . . . . . . . 4 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Test information . . . . . . . . . . . . . . . . . . . . . . . . . 7 Quality information . . . . . . . . . . . . . . . . . . . . . . 7 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 8 Packing information. . . . . . . . . . . . . . . . . . . . . . 8 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 10 Legal information. . . . . . . . . . . . . . . . . . . . . . . 11 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 11 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Contact information. . . . . . . . . . . . . . . . . . . . . 11 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Please be aware that important notices concerning this document and the product(s) described herein, have been included in section `Legal information'.
(c) NXP B.V. 2008.
All rights reserved.
For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 31 March 2008 Document identifier: PZUXDB2_SER_1

▲Up To Search▲

Price & Availability of PZU24DDG

	To Download PZU24DDG Datasheet File
If you can't view the Datasheet, Please click here to try to view without PDF Reader .